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281 Publications
140 Journals
Shiv Govind Singh
Professor
Department of Electrical Engineering
sgsingh@ee.iith.ac.in (Work)
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Publications - 281
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Publications (281)
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Publications (281)
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Articles
Oxidation Resistive, CMOS Compatible Copper-Based Alloy Ultrathin Films as a Superior Passivation Mechanism for Achieving 150 °c Cu-Cu Wafer on Wafer Thermocompression Bonding
A.K. Panigrahi
,
T. Ghosh
,
Shiv Govind Singh
and
Siva Rama Krishna Vanjari
2017 | Institute of Electrical and Electronics Engineers Inc.
Conferences
Silk piezoelectric thin films: Materials to devices
J. Joseph
,
S. Saraswathi
,
...
,
Shiv Govind Singh
and
Siva Rama Krishna Vanjari
(5 authors)
2017 | Institute of Electrical and Electronics Engineers Inc.
Articles
One step biofunctionalized electrospun multiwalled carbon nanotubes embedded zinc oxide nanowire interface for highly sensitive detection of carcinoma antigen-125
K.B. Paul
,
V. Singh
,
...
,
Shiv Govind Singh
(4 authors)
2017 | Elsevier Ltd
Articles
A multi-walled carbon nanotube-zinc oxide nanofiber based flexible chemiresistive biosensor for malaria biomarker detection
B. Paul
,
A.K. Panigrahi
,
...
,
Shiv Govind Singh
(4 authors)
2017 | Royal Society of Chemistry
Conferences
Area-elficient interlayer signal propagation in 3D IC by introducing electron spin
S. Debroy
,
Amit Acharyya
,
...
,
Shiv Govind Singh
(4 authors)
2017 | Institute of Electrical and Electronics Engineers Inc.
Conferences
A compact, resource sharing on-chip soft-start technique for automotive DC-DC converters
K.T. Hafeez
,
Ashudeb Dutta
,
...
,
Shiv Govind Singh
(4 authors)
2017 | Institute of Electrical and Electronics Engineers Inc.
Conferences
Noise performance improvement through optimized stacked layer of liner structure around the TSV in 3D IC
C. Hemanth Kumar
,
A. Kumar Panigrahi
,
...
,
Shiv Govind Singh
(4 authors)
2017 | Institute of Electrical and Electronics Engineers Inc.
Conferences
Optimized ultra-thin Manganin alloy passivated fine-pitch damascene compatible Cu-Cu bonding at sub 200°C for 3D IC integration
A.K. Panigrahi
,
C.H. Kumar
,
...
,
Shiv Govind Singh
(5 authors)
2017 | Institute of Electrical and Electronics Engineers Inc.
Conferences
Facile, low-cost, halochromic platform using electrospun nanofibers for milk adulteration detection
S. Tripathy
,
K. Deep
,
...
,
Shiv Govind Singh
and
Siva Rama Krishna Vanjari
(5 authors)
2017 | Institute of Electrical and Electronics Engineers Inc.
Articles
Leveraging Innate Piezoelectricity of Ultra-Smooth Silk Thin Films for Flexible and Wearable Sensor Applications
J. Joseph
,
Shiv Govind Singh
and
Siva Rama Krishna Vanjari
2017 | Institute of Electrical and Electronics Engineers Inc.
Conferences
Novel inter layer dielectric and thermal TSV material for enhanced heat mitigation in 3-D IC
K. Khurram
,
A. Kumar Panigrahi
,
...
,
Shiv Govind Singh
(5 authors)
2017 | Institute of Electrical and Electronics Engineers Inc.
Conferences
Zinc oxide nanowire modified flexible plastic platform for immunosensing
B. Paul
,
R.R. Reddy
,
Shiv Govind Singh
and
Siva Rama Krishna Vanjari
2017 | Institute of Electrical and Electronics Engineers Inc.
Conferences
Transient suppression with pseudo error voltage technique for wide supply range automotive DC-DC converters
K.T. Hafeez
,
Ashudeb Dutta
,
...
,
Shiv Govind Singh
(4 authors)
2017 | Institute of Electrical and Electronics Engineers Inc.
Articles
Electrochemical Detection of Cardiac Biomarkers Utilizing Electrospun Multiwalled Carbon Nanotubes Embedded SU-8 Nanofibers
M.D. Prakash
,
Chandra Shekhar Sharma
,
...
,
Shiv Govind Singh
(4 authors)
2017 | Wiley-VCH Verlag
Articles
Optimal don’t care filling for minimizing peak toggles during at-speed stuck-at testing
A.S. Trinadh
,
S. Potluri
,
Ch. Sobhan Babu
,
...
,
Shiv Govind Singh
(5 authors)
2017 | Association for Computing Machinery
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Conferences
Analysis of graphene and CNT based finned TTSV and spreaders for thermal management in 3D IC
S. Singh
,
A. Kumar Panigrahi
,
...
,
Shiv Govind Singh
(4 authors)
2017 | Institute of Electrical and Electronics Engineers Inc.
Conferences
Low temperature CMOS compatible Cu-Cu thermo-compression bonding with constantan alloy passivation for 3D IC integration
A. Kumar Panigrahi
,
S. Bonam
,
...
,
Shiv Govind Singh
and
Siva Rama Krishna Vanjari
(5 authors)
2017 | Institute of Electrical and Electronics Engineers Inc.
Articles
Impact of Cl Doping on Electrochemical Performance in Orthosilicate (Li2FeSiO4): A Density Functional Theory Supported Experimental Approach
Shiv Govind Singh
,
A.K. Raj
,
...
,
S. Mitra
(5 authors)
2017 | American Chemical Society
Articles
Heat rate distribution in converging and diverging microchannel in presence of conjugate effect
V.S. Duryodhan
,
Shiv Govind Singh
and
A. Agrawal
2017 | Elsevier Ltd
Articles
Mixing in planar spiral microchannel
V.S. Duryodhan
,
R. Chatterjee
,
Shiv Govind Singh
and
A. Agrawal
2017 | Elsevier Inc.
Showing 121-140 of 281 results
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