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Novel inter layer dielectric and thermal TSV material for enhanced heat mitigation in 3-D IC
K. Khurram
,
A. Kumar Panigrahi
,
S. Bonam
,
O. Krishan Singh
,
Shiv Govind Singh
Published in Institute of Electrical and Electronics Engineers Inc.
2017
DOI:
10.1109/3DIC.2016.7970005
Abstract
In this paper, heat transfer in 3D IC system is investigated using practical and novel materials for Inter Layer Dielectric (ILD) and Thermal Through Silicon Vias (TTSV). The currently used SiO2 ILD is amiss for heat mitigation due to its poor thermal conductivity. The unique thermal and electrical properties of Hexagonal Boron Nitride (h-BN) are explored in this work for improved heat mitigation. © 2016 IEEE.
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2016 IEEE International 3D Systems Integration Conference, 3DIC 2016
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Institute of Electrical and Electronics Engineers Inc.
Authors (1)
Shiv Govind Singh
Department of Electrical Engineering
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