3-D ICs technology Development (Interconnects, electro-migration, Electrical and Thermal Modeling of 3-D ICs, Thermal and power aware placement of TSV (both signal and thermal) RF MEMS device design simulation fabrication and Charterization Micro/Nano fluidics, Electronics cooling, Lab on chip 3D solar cell, Ultra low power solar cell based energy harvesting ckt Milk Net, Synthetic tree, Water adulterant, Mechanical to Electrical Energy Conversion.