This paper reports low temperature Cu-Cu thermocompression bonding with the help of self-assembled monolayer (SAM) desorption. SAM layer protects copper from oxidation. It should be desorbed just before bonding. The desorption was carried out using cyclic voltammetry in aqueous potassium hydroxide (KOH) solution. Contact angle measurements carried out before and after desorption indicates successful desorption of SAM. The bonding was carried out at 150 °C and has yielded in excellent bond strength of 520 N. © 2014 IEEE.

Shiv Govind Singh

Department of Electrical Engineering

T. Ghosh

V.S.R. Krishna

Indian Institute of Technology Hyderabad (IITH) is a premier institute of science and technology established in 2008. IITH has been consistently ranked in the&nbsp;<a href="https://iith.ac.in/reports/" rel="noopener noreferrer">top 10 institutes</a>&nbsp;in India for Engineering&nbsp;<a href="https://www.nirfindia.org/2021/EngineeringRanking.html" rel="noopener noreferrer" target="_blank">according to NIRF</a>&nbsp;making it one of the most coveted schools for science and technology in the country.

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Journal	Data powered by Typeset2014 IEEE 2nd International Conference on Emerging Electronics: Materials to Devices, ICEE 2014 - Conference Proceedings
Publisher	Data powered by TypesetInstitute of Electrical and Electronics Engineers Inc.