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Cu-Cu diffusion bonding enhancement at low temperature by surface passivation using self-assembled monolayer of alkane-thiolPublished in
2009
DOI: 10.1063/1.3263154
Volume: 95
Issue: 19
Self-assembled monolayer (SAM) of 1-hexanethiol is applied on copper (Cu) surface to retard surface oxidation during exposure in the ambient. This SAM layer can be desorbed effectively with an annealing step in inert N2 ambient to provide a clean Cu surface. Using this passivation method with SAM, wafers covered with thin Cu layer are passivated, stored, desorbed, and bonded at 250 °C. The bonded Cu layer presents clear evidence of substantial interdiffusion and grain growth despite prolonged exposure in the ambient. This method of passivation is proven to be effective and can be further optimized to enable high quality Cu-Cu direct bonding at low temperature for application in three-dimensional integration. © 2009 American Institute of Physics.
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Content may be subject to copyright.This article may be downloaded for personal use only. Any other use requires prior permission of the author and AIP Publ... ...This article may be downloaded for personal use only. Any other use requires prior permission of the author and AIP Publishing. This article appeared in [Cu–Cu diffusion bonding enhancement at low temperature by surface passivation using self-assembled monolayer of alkane-thiol. Applied Physics Letters 95, 19 p192108 (2009)] and may be found at https://doi.org/10.1063/1.3263154.
About the journal
| Journal | Applied Physics Letters |
|---|---|
| ISSN | 00036951 |
Authors (1)
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