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Water vapor barrier material by covalent self-assembly for organic device encapsulation
G.N. Kopanati, S. Seethamraju, P.C. Ramamurthy,
Published in American Chemical Society
2014
Volume: 53
   
Issue: 46
Pages: 17894 - 17900
Abstract
Development of barrier materials for organic device encapsulation is of key interest for the commercialization of organic electronics. In this work, we have fabricated barrier films with ultralow water vapor permeabilities by reactive layer-by-layer approach. Using this technique, alternative layers of polyethylene imine and stearic acid were covalently bonded on a Surlyn film. The roughness, transparency and thickness of the films were determined by atomic force microscopy, UV-visible spectroscopy and scanning electron microscopy, respectively. Water vapor transmission rates through these films and the ability of these films to protect the organic photovoltaic devices was investigated. The films with covalently assembled bilayers exhibited lower water vapor transmission rates and maintained higher organic photovoltaic device efficiencies compared to the neat Surlyn film. © 2014 American Chemical Society.
About the journal
JournalData powered by TypesetIndustrial and Engineering Chemistry Research
PublisherData powered by TypesetAmerican Chemical Society
ISSN08885885