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Super-MAC: Data Duplication and Combining for Reliability Enhancements in Next-Generation Networks
A.M. Ahmed, A. Patel,
Published in Institute of Electrical and Electronics Engineers Inc.
2021
Volume: 9
   
Pages: 54671 - 54689
Abstract
A piece of user equipment (UE), typically, has access to multiple radio access technologies (RATS). Moreover, apart from the standard primary cellular network, the secondary cellular networks can assist the primary network in downlink UE communications. In this way, the data can reach the UEthrough multiple entities. This paper exploits the multiple entities' idea by proposing a cross-layer scheme that combines data to improve the block error rate (BLER) and the throughput. For this, we define a new entity, called the super-MAC, just above the Medium Access Control (MAC) layer. Morespecifically, we propose data duplication (at the transmitter) and combining (at UE) at the super-MAC, where the super-MAC gets the Radio Link Layer protocol data unit (RLC-PDU) and sends multiple-copies across various interfaces to different MAC-entities. In doing so, the super-MAC attaches a unique sequence number to a group of RLC-PDUs together. At the UE, the data from different MAC entities are combined at super-MAC to clear any block error. The super-MAC operates in between the CyclicRedundancy Check and Forward Error Correction stages of the HARQ process. The additional complexityintroduced by the scheme is negligible in front of the existing operations. Moreover, the average latency improves due to the significant improvement in the Block Error rate (BLER) that the combining scheme offers over the BLER of the conventional standalone system. Also, since the errors significantly reduce, the throughput shows significant improvement. Finally, the proposed scheme is an advancement in HARQ to reduce retransmissions, and hence it is suitable for the next-generation networks like B5G or 6G to adopt the super-MAC. © 2013 IEEE.
About the journal
JournalData powered by TypesetIEEE Access
PublisherData powered by TypesetInstitute of Electrical and Electronics Engineers Inc.
ISSN21693536