In this manuscript, Inter-Layer Exchange Coupled (IEC) based 2-bit multiplier architecture model methodology has been proposed here and to the best of author's knowledge is the first of its kind. Subsequently, the proposed model methodology has been executed using the extensively recognized Object Oriented Micro-Magnetic Framework (OOMMF) platform. The reliability of the IEC based multiplier model was determined by analyzing the temperature variation impact up to the Curie temperature. It was noticed that unlike the dipole coupled architecture, the IEC based multiplier model has the capability of operating even up to Curie temperature at sub-50nm justifying stability with respect to the temperature variations. © 2002-2012 IEEE.