Header menu link for other important links
X
Interface microstructures and bond formation in ultrasonic consolidation
, Y. Yang, C. Nylander, B. Aydelotte, B.E. Stucker, B.L. Adams
Published in University of Texas at Austin (freeform)
2007
Pages: 266 - 283
Abstract
The quality of ultrasonically consolidated parts critically depends on the bond quality between individual metal foils. This necessitates a detailed understanding of interface microstructures and ultrasonic bonding mechanism. There is a lack of information on interface microstructures in ultrasonically consolidated parts as well as a lack of consensus on the mechanism of metal ultrasonic welding, especially on matters such as plastic deformation and recrystallization. In the current work, interface microstructures of an ultrasonically consolidated multi-material Al 3003-Ni 201 sample were analyzed in detail using optical microscopy, scanning electron microscopy, energy dispersive spectroscopy, and orientation imaging microscopy. Based on the results of microstructural studies, the mechanism of metal ultrasonic welding has been discussed. The reasons for formation of defects/unbonded regions in ultrasonically consolidated parts have also been identified and discussed.
About the journal
Journal18th Solid Freeform Fabrication Symposium, SFF 2007
PublisherUniversity of Texas at Austin (freeform)