The etching characteristics of Si{111} in pure and NH2OH-added 20 wt% KOH are investigated for the fabrication of MEMS structures using silicon wet bulk micromachining. The addition of NH2OH favorably modifies the etching characteristics of 20 wt% KOH, which are useful for high speed silicon wet bulk micromachining for the fabrication MEMS structures such as cavities, microcantilevers, etc. In addition, the lateral undercutting rate drastically increases in NH2OH-added KOH, which is a desirable property for the fast release of freestanding micro/nanoelectromechanical systems (M/NEMS) structures. © 2020 IEEE.

Ashok Kumar Pandey

Department of Mechanical and Aerospace Engineering

Prem Pal

Department of Physics

A.V.N. Rao

P.K. Menon

H. Tanaka

K. Sato

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2020 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2020

High Speed Silicon Wet Bulk Micromachining of Si{111} in KOH Based Solution

Journal	Data powered by Typeset2020 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2020
Publisher	Data powered by TypesetInstitute of Electrical and Electronics Engineers Inc.