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Effect of current density on the pulsed co-electrodeposition of nanocrystalline nickel-copper alloys
M. Agarwal, V. Kumar, , R. Balasubramaniam, K. Balani
Published in
2010
Volume: 62
   
Issue: 6
Pages: 88 - 92
Abstract
Nanocrystalline coatings have become an essential component of single and multilayer electronic packaging, ship building, mining, magnetorestrictive applications, etc. In the current work, nanocrystalline Ni-Cu films were synthesized by pulsed electrode-position using a citrate bath. Cathodic polarization experiments were carried out for optimization of bath composition to co-deposit nanocrystalline Ni-Cu films. Depositions were optimized between the current density range of 0.05-0.25 Acmr2to achieve a uniform equiaxed coating with a target Ni content of greater than 70% owing to their superior corrosion resistance and enhanced hardness.
About the journal
JournalJOM
ISSN10474838