A model for the kinetics of residual stress evolution is described that can be applied to both the relaxation during a growth interruption and the recovery following resumption of growth. The stress is attributed to simple atomistic processes based on reversible diffusion of atoms in and out of the grain boundary. Each of these processes is considered separately to understand how the rates differ during relaxation and recovery and how they depend on grain size, film thickness, temperature, deposition rate, and initial stress. The model is compared with experimental data obtained by others for several materials (Fe, Ni and Au). © 2020 Acta Materialia Inc.

Piyush Vijay Jagtap

Department of Materials Science and Metallurgical Engineering

E. Chason

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Journal	Acta Materialia
Publisher	Acta Materialia Inc
ISSN	13596454